Authors:Fu, HH (Fu, Haohuan); Gan, L (Gan, Lin); Clapp, RG (Clapp, Robert G.); Ruan, H (Ruan, Huabin); Pell, O (Pell, Oliver); Mencer, O (Mencer, Oskar); Flynn, M
(Flynn, Michael); Huang, XM (Huang, Xiaomeng); Yang, GW (Yang, Guangwen)
Journal:IEEE MICRO